Low Temp. Microwave Plasma Descum & Ashing

Batch wafer plasma system - GIGAbatch 310M

Batch wafer plasma system - GIGAbatch 310M

연구소용 6" batch microwave plasma asher.
600W.Descum, MEMS 희생층 제거, SU8 제거.
6" 혹은 8" single wafer cooling chuck (Option,
Room Temp ~ 95℃)

Batch wafer plasma system - GIGAbatch 360/380M

6"(360M)/ 8"(380M) batch microwave
plasma asher. 1000W.Descum, MEMS
희생층 제거, 공랭식 온도 control system

Batch wafer plasma system - GIGAbatch 360/380M
Batch wafer plasma system - GIGAbatch 360/380P + Auto Wafer Transfer System

Batch wafer plasma system - GIGAbatch 360/380P + Auto Wafer Transfer System

Max 8" wafer 25장을 한번에 자동 loading/
unloading가능 microwave plasma asher.
1000W. Descum, MEMS 희생층 제거, 공랭식 온도
control system

Single wafer plasma system - GIGAfab M

Max 12" 단일 wafer microwave plasma asher,
Max 4000W. Heat & cooling plate 온도 control
system.Descum, MEMS 희생층 제거, SU8 제거

Single wafer plasma system - GIGAfab M
Single wafer plasma system - GIGAfab A200/A300

Single wafer plasma system - GIGAfab A200/A300

Max 12" 단일 wafer microwave plasma
asher, Max 4000W. Auto wafer loading
by FOUP

Single wafer plasma system - GIGAfab Modular

Max 8" wafer cluster type multi-chamber
auto loading microwave plasma asher

Single wafer plasma system - GIGAfab Modular
Silicon rod 및 top/tail thermal cracker

Silicon rod 및 top/tail thermal cracker

300mm MCZ crystal growing 고순도 공정을 위한
9N 또는 11N용 Poly Si chip 제조 COP Free
(결정결함이 없는) 둥근모양의 Poly Si chip 및
chunk 제조 장비

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